This paper introduced the influencing factors of dielectric support process design through material selection, structural manufacturability design, injection molding process design and assembly process design. From the comparison of the main performance parameters of commonly used engineering plastics, the preferred material for dielectric carriers was glass fiber reinforced modified PPO (MPPO-109GF20). Aiming at the design factors that affect the injection molding of dielectric support, the rounded corners and wall thickness of the dielectric support were optimized. The sprue position and process parameters of dielectric support were optimized for the process conditions that affected injection molded parts. The dielectric support must be cleaned with alcohol cleaner. The dedicated assembly fixture was designed during the assembly phase to limit and calibrate the antenna unit. When installing screws, silicone rubber was compatible with polyphenylene ether materials and preferred as the adhesive for sealing, connecting, and locking. The improved dielectric support was produced and assembled in two batches, both of which met the design specifications. The cracking phenomenon has never occurred again. And it had been verified by batch stable production. This paper provided the useful technological design of dielectric support or similar modules as reference.