The chip power is increased due to the increase in computational processing. The increase in chip power leads to serious chip heating, so the requirements for chip heat sink cooling efficiency increase. In this paper, a passive chip heat sink is designed taking into account the requirements of chip heat dissipation and integrated structure. Factors affecting the heat dissipation of passive chip heat sinks are investigated using finite element analysis. To study the influence law of passive chip heat sink geometry, metal material, and chip power on the heat dissipation effect. A pin-straight ribbed heat sink was designed to dissipate heat better than the original pin and straight ribbed heat sinks with the same parameters. Under the same parameters, the difference in the thermal efficiency of copper heat sinks compared to aluminum heat sinks is relatively small, and aluminum can be chosen as the heat sink when considering the cost of materials. The use of steel material as a heat sink is an option in case of low power of heat source chips. The results of the study can provide help in designing passive chip heat sinks.