The thermal deformation behavior of 2219 alloy is studied by using the Gleeble-1500 thermal simulation testing machine under different deformation conditions, the deformation temperature is 350°C∼500°C and the strain rate is 0.01∼1s^-1. The results show that when the strain rate increases, the flow stress also increases. However, when the deformation temperature increases, the flow stress decreases. Analyzing the deformed and solution treatment microstructure evolution of 2219 alloy though the electron back-scattering diffraction (EBSD). There are mainly deformed grains and only a few recrystallization grains of 2219 alloy after thermal deformed. When the deformation temperature is high and the strain rate is low, it is easy to occur dynamic recrystallization. After solution treatment, the microstructure of 2219 alloy occurs static recrystallization, which is advantageous at 350°C and 0.1s^-1. When the deformation temperature is low and the strain rate is large, it is easy to occur static recrystallization after solution treatment. When 2219 alloy deforms at higher temperatures, using a higher strain rate can effectively suppress recrystallization.