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Volumetric and Surface Flaw Models for the Computation of the EC T/R Probe Signal due to a Thin Opening Flaw
Léa Maurice, Denis Prémel, Jozsef Pàvò, Dominique Lesselier, Alain Nicolas
49 - 56
Studies in Applied Electromagnetics and Mechanics
Volume 28: Electromagnetic Nondestructive Evaluation (X)
Abstract

This paper is concerned with the dyadic Green formalism in order to develop simulation tools dedicated to Eddy Current Non Destructive Testing (ECNDT). The Volume Integral Method (VIM) is useful when considering volumetric flaws. The Surface Integral Method (SIM) is more appropriate for thin opening flaws. This latter fast method provides accurate results, except in some critical Transmitting / Receiving (T/R) configurations. In such cases, we propose to combine VIM and SIM to obtain satisfactory results.

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